This article focuses on the upcoming technologies in the field of HVAC used in Data Centers.
As we know that HVAC plays a major role in Data Center cooling, it is also important to understand that
HVAC systems consume high amounts of power to run them. On average around 25% to 40% of the total
power consumption of the data center goes towards running the HVAC systems like Water cooled
chiller, Air cooled Chiller, Precision Air Handling Unit (PAHU) {Also Called Computer Room Air Handling
Unit (CRAHU)}, Precision Air conditioners (PAC) {Also called as Computer Room Air Conditioner(CRAC)}
etc. With the world moving towards clean energy and energy-saving options the focus is shifting very
much upon HVAC technologies which are efficient in power saving and in the usage of footprint.
To solve this issue HVAC engineers have come up with solutions based on Liquid cooling Technologies.
Though the early stages of Liquid Cooling systems were complicated and expensive, the latest
equipment is more efficient and effective in cooling. Liquid cooling technology does not have the issues
of high-power requirements, pollutants, and condensation in the Data Center. Liquid cooling systems
are cleaner, scalable to larger requirements in Data Centers, and highly effective. The common liquid
Cooling methods are Immersion Cooling and Direct to Chip Cooling.
In Immersion Cooling the hardware is submerged directly into a tub of Non-Conductive, non-flammable
dielectric liquid. We use a leak proof case to contain the dielectric liquid and the hardware. This dielectric
liquid absorbs the heat from the hardware and condenses inside the case and falls back again into the
Fluid.
- In Immersion Cooling the hardware is submerged directly into a tub of Non-Conductive, non-flammable dielectric liquid. We use a leak proof case to contain the dielectric liquid and the hardware. This dielectric liquid absorbs the heat from the hardware and condenses inside the case and falls back again into the Fluid.
In Direct to chip cooling we use small tubes to deliver a liquid coolant directly into the cold plate which is
on top of the motherboard chips. This liquid coolant is used to draw off the heat from the hardware.
This extracted heat is transported back to the cooling plant through a chilled water loop and the heat is
transferred directly to the atmosphere. These two systems are found to be efficient not only for the
data centers but any critical facility. More on this to be followed in the upcoming articles.
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